Modelithics® 是为射频（RF）、微波、半导体及毫米波电子器件提供创新型高质量定制建模与测量服务的行业领导者，推出适用于 Ansys HFSS 的 Modelithics COMPLETE+3D Library v26.3。此次更新新增了 100 多个模型（涵盖约 650 款独立器件），涉及无源元件、系统级及 3D 组件模型等类别，并扩展了对 Ansys HFSS 2024 – 2026 版本的兼容性。 可用版本: 2026.x , 2025.x , … Modelithics COMPLETE+3D 26.3 For Ansys HFSS 2024-2026R1 26.3 版本扩展了 Modelithics 3D 库，新增了 24 款村田（Murata）电感器模型，以及 TTM Technologies 的耦合器和电阻器模型，以支持全波电磁仿真工作流程。这些 3D 模型均经过精密测量验证，且不依赖于特定的基板定义，能够支持先进的 HFSS 电磁分析。 此次发布还显著扩充了 Modelithics 无源元件产品组合，新增了来自行业领先制造商的电容器、电感器和电阻器系列的 Microwave Global Models™（微波全局模型），这些模型支持基板和元件参数值的缩放。新增的电容器模型涵盖了 Kyocera-AVX、Cornell Dubilier、村田（Murata）和 Knowles-Syfer 等品牌。来自 Coilcraft、Gowanda、村田（Murata）、Piconics 和 Vanguard 的新型 Microwave Global 电感器模型，覆盖了广泛的封装形式、基板类型、元件参数值及频率范围。此外，该版本还引入了来自 IMS、SOTA、TTM Technologies 和 Vishay 的新型 Microwave Global 电阻器模型，进一步增强了该库对高频电路及子系统设计的支持能力。通过将基于测量的 Modelithics 模型与 Ansys HFSS 全波电磁仿真相结合，设计人员能够提高模型精度，并简化射频（RF）、微波及毫米波的设计验证流程。 COMPLETE+3D 库中的系统级元件模型阵容也得到了扩充，新增了来自 Analog Devices、Guerrilla RF 和 Mini-Circuits 的放大器模型。此外，现已提供来自 Aeroflex 和 Smiths Interconnect 的衰减器模型，MACOM、Mini-Circuits 和 TTM Technologies 的耦合器模型，IMS、MACOM、Mini-Circuits 和 Smiths Interconnect 的功分器模型，以及 MACOM、Mini-Circuits 和 Vanguard 的变压器模型。该版本还包含新的 Mini-Circuits 滤波器模型，进一步扩展了对完整射频和微波信号链仿真的支持。 More for English: Modelithics COMPLETE+3D 26.3 For Ansys HFSS 2024-2026R1
Ansys Totem is the proven, trusted industry leader for power noise and reliability signoff for analog and mixed-signal designs built on cloud-native elastic compute infrastructure. Available versions: 2025.x ,2024.x ,2023.x ,… ANSYS Totem/Totem-SC 2025R2.2 Linux64 Tested Picture Ansys Totem revolutionizes transistor-level power integrity and reliability analysis, empowering users to conduct thorough assessments on analog mixed-signal IP and full-custom designs. It reshapes the conventional flow of analog mixed-signal power noise and reliability analysis by accommodating various design environments for modeling and characterization. Totem boasts a robust extraction and simulation engine, complemented by an intuitive graphical interface for in-depth root cause analysis and debugging of results. Power Integrity and Noise Verification at Transistor Level Totem-SC offer an ultra high-capacity version of Totem...
RedHawk-SC is the proven, trusted industry leader for power noise and reliability signoff for digital IP and SoCs down to 3nm and built on cloud-native elastic compute infrastructure Available versions: 2025.x ,2024.x ,2023.x ,… ANSYS Redhawk 2025R2.2 Linux64 Tested Picture RedHawk-SC is the premier solution for power noise and reliability signoff, renowned for its reliability in digital IP and SoCs scaling down to 3nm. It boasts a cloud-native elastic compute infrastructure, ensuring scalability and flexibility to meet the evolving demands of semiconductor design. As the trusted industry leader, RedHawk-SC provides comprehensive support for power integrity verification, enabling designers to achieve optimal performance and reliability in their designs while leveraging cutting-edge technology and cloud resources. IR-drop signoff Thermal-aware EM analysis Timing...
CivilFEM 支持 ANSYS 支持的所有类型的高级分析（动态、静态、线性和非线性），并可作为一款独立的软件运行。CivilFEM 采用模块化设计，由名为 CivilFEM INTRO 的通用产品和针对特定土木工程需求的专用模块组成，例如桥梁和土木非线性模块、高级预应力混凝土模块以及岩土工程模块，这些专用模块可以可选地添加到 CivilFEM INTRO 中。 可用版本: 2025.x ,2024.x ,2023.x ,… CivilFEM 2021 for ANSYS 19.x-2021 Tested Picture CivilFEM 多学科版包含了所有为 CivilFEM 开发的专业模块（入门模块、岩土模块、桥梁和土木非线性模块以及高级预应力钢筋混凝土模块），为用户提供满足其所有土木工程需求的完整解决方案。 最新版本的 CivilFEM 支持多个 ANSYS 版本。“CivilFEM 2025 for ANSYS”可与 ANSYS 2025 以及更早版本的 ANSYS（2020、2021、2022、2023、2024 和 2025）兼容运行。如果您希望 CivilFEM 支持其他 ANSYS 版本，请联系 Ingeciber。 More Information in English: CivilFEM 2025 for ANSYS 2020-2025
Ansys Lumerical is a complete photonics simulation software solution that supports the design of photonics components, circuits, and systems. Device and system level tools work seamlessly together, enabling users to model the optical, electrical, and thermal effects of interactions. The flexible interoperability between products supports various workflows that combine device multi physics field and photon circuit simulation with third-party design automation and productivity tools. This software can be said to be a representative software in the field of photonics simulation, and it is also the most widely cited tool in scientific research journals. Enhancements to Lumerical 2024R2.2 include: Improvements to the GPU acceleration for the Lumerical finite-difference time-domain (FDTD) solver with faster meshing and multi-GPU extended memory capacity. A new scalable cluster...
Many thousands of layout parasitics dominate integrated circuit (IC) performance. ParagonX provides early, fast, and easy parasitic analysis with visual debugging and root-cause detection. ParagonX lets IC design engineers shift left to quickly explore and find the root causes of parasitic-induced design issues. It enhances existing EDA workflows with powerful analytics and visual feedback for identifying the root causes of layout parasitics’ impact on performance, precision, robustness, and reliability earlier in the design cycle.
A pre-LVS electromagnetic modeling solution that combines the gold standard Ansys HFSS electromagnetic simulation engine with the silicon-optimized Ansys RaptorX engine. Ansys RaptorH is an electromagnetic modeling software with capacity to model power grids, full custom blocks, spiral inductors, and clock trees. Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH can analyze partial and unfinished layouts during the design phase and makes it easy to use either the general purpose HFSS engine or the silicon-optimized RaptorX engine for silicon structures.
PowerArtist is the industry-leading RTL power analysis and reduction software with the most comprehensive features to enable power-efficient design early in the design flow. Ansys PowerArtist is the comprehensive RTL design-for-power platform of choice of leading low-power semiconductor companies for early power analysis and reduction. PowerArtist includes physically-aware RTL power accuracy, interactive power debug, analysis-driven power reduction, unique metrics for tracking power efficiency and vector coverage, rapid power profiling of real workloads, and seamless enablement of RTL-to-physical power grid integrity.
Ansys RedHawk-SC Electrothermal features multiphysics power integrity, signal integrity, thermal integrity, and mechanical stress simulation and analysis for 2.5D/3D multi-die systems. The Ansys RedHawk-SC Electrothermal is a Multiphysics simulation platform. It delivers a complete solution for analyzing multi-die chip packages and interconnects for power integrity, layout parasitic extraction, thermal profiling, thermo-mechanical stress, and signal integrity. Integrated within the cloud-native SeaScape platform enables high-capacity electrothermal analysis for early-design exploration, post-layout design verification, and silicon signoff of stacked-die system. It is foundry certified for integrated fanout and silicon interposer technologies.
Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification. Features Power integrity (EM/IR) analysis and modeling with RedHawk-SC for digital, and Totem-SC for analog designs Electrothermal analysis of 2.5D/3D multi-die systems Variability-aware path timing with Path FX Electrostatic discharge (ESD) and reliability analysis with PathFinder-SC RTL power analysis and reduction with PowerArtist On-silicon electromagnetic analysis and modeling with RaptorH, Pharos, Exalto, and VeloceRF Cloud-native elastic compute architecture for full-chip capacity
