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ANSYS Redhawk-SC 2025R2.2 Linux64-Engsofts

ANSYS Redhawk-SC 2025R2.2 Linux64

RedHawk-SC is the proven, trusted industry leader for power noise and reliability signoff for digital IP and SoCs down to 3nm and built on cloud-native elastic compute infrastructure Available versions: 2025.x ,2024.x ,2023.x ,… ANSYS Redhawk 2025R2.2 Linux64 Tested Picture RedHawk-SC is the premier solution for power noise and reliability signoff, renowned for its reliability in digital IP and SoCs scaling down to 3nm. It boasts a cloud-native elastic compute infrastructure, ensuring scalability and flexibility to meet the evolving demands of semiconductor design. As the trusted industry leader, RedHawk-SC provides comprehensive support for power integrity verification, enabling designers to achieve optimal performance and reliability in their designs while leveraging cutting-edge technology and cloud resources. IR-drop signoff Thermal-aware EM analysis Timing...

ANSYS Redhawk-SC Electrothermal 2024R2.2 Linux64

Ansys RedHawk-SC Electrothermal features multiphysics power integrity, signal integrity, thermal integrity, and mechanical stress simulation and analysis for 2.5D/3D multi-die systems. The Ansys RedHawk-SC Electrothermal is a Multiphysics simulation platform. It delivers a complete solution for analyzing multi-die chip packages and interconnects for power integrity, layout parasitic extraction, thermal profiling, thermo-mechanical stress, and signal integrity. Integrated within the cloud-native SeaScape platform enables high-capacity electrothermal analysis for early-design exploration, post-layout design verification, and silicon signoff of stacked-die system. It is foundry certified for integrated fanout and silicon interposer technologies.

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