Tag:Redhawk-SC

Ansys RedHawk-SC Electrothermal features multiphysics power integrity, signal integrity, thermal integrity, and mechanical stress simulation and analysis for 2.5D/3D multi-die systems. The Ansys RedHawk-SC Electrothermal is a Multiphysics simulation platform. It delivers a complete solution for analyzing multi-die chip packages and interconnects for power integrity, layout parasitic extraction, thermal profiling, thermo-mechanical stress, and signal integrity. Integrated within the cloud-native SeaScape platform enables high-capacity electrothermal analysis for early-design exploration, post-layout design verification, and silicon signoff of stacked-die system. It is foundry certified for integrated fanout and silicon interposer technologies.

RedHawk-SC is the proven, trusted industry leader for power noise and reliability signoff for digital IP and SoCs down to 3nm and built on cloud-native elastic compute infrastructure Ansys RedHawk-SC is the industry’s trusted gold standard for voltage drop and electromigration multiphysics signoff solutions in digital designs. Its breakthrough SigmaDVD™  technology provides complete coverage for dynamic voltage drop analysis. Its powerful analytics identify weaknesses and allow what-if explorations to optimize power and performance. Redhawk-SC’s cloud-based architecture gives it the speed and capacity to handle full-chip analysis. Signoff accuracy is certified by all major foundries for all finFET nodes down to 2 nm.