Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a common data-model to integrate design, die-to-die routing, native system analysis, verification, and signoff in a single environment. Synopsys 3DSO.ai, industry’s first autonomous AI optimization solution for 2.5D and 3D heterogeneous design and integration, seamlessly integrates with 3DIC Compiler to maximize system performance and quality of results at a rapid pace for thermal integrity, signal integrity, and power network design. Ensuring system technology co-optimization (STCO), Synopsys 3DIC Compiler is certified by all foundries and leveraged successfully by customers in dozens of designs.
Key Benefits
Unmatched Scalability
System-of-chips integration over hundreds of billions of transistors
High Productivity
Fast exploration and design using world-class implementation and analysis engines
Golden Signoff
Full spectrum design closure and convergence to optimal PPA/mm3
