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Electrical & Power Engineering softwares.
A pre-LVS electromagnetic modeling solution that combines the gold standard Ansys HFSS electromagnetic simulation engine with the silicon-optimized Ansys RaptorX engine. Ansys RaptorH is an electromagnetic modeling software with capacity to model power grids, full custom blocks, spiral inductors, and clock trees. Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH can analyze partial and unfinished layouts during the design phase and makes it easy to use either the general purpose HFSS engine or the silicon-optimized RaptorX engine for silicon structures.
PowerArtist is the industry-leading RTL power analysis and reduction software with the most comprehensive features to enable power-efficient design early in the design flow. Ansys PowerArtist is the comprehensive RTL design-for-power platform of choice of leading low-power semiconductor companies for early power analysis and reduction. PowerArtist includes physically-aware RTL power accuracy, interactive power debug, analysis-driven power reduction, unique metrics for tracking power efficiency and vector coverage, rapid power profiling of real workloads, and seamless enablement of RTL-to-physical power grid integrity.
Ansys RedHawk-SC Electrothermal features multiphysics power integrity, signal integrity, thermal integrity, and mechanical stress simulation and analysis for 2.5D/3D multi-die systems. The Ansys RedHawk-SC Electrothermal is a Multiphysics simulation platform. It delivers a complete solution for analyzing multi-die chip packages and interconnects for power integrity, layout parasitic extraction, thermal profiling, thermo-mechanical stress, and signal integrity. Integrated within the cloud-native SeaScape platform enables high-capacity electrothermal analysis for early-design exploration, post-layout design verification, and silicon signoff of stacked-die system. It is foundry certified for integrated fanout and silicon interposer technologies.
RedHawk-SC is the proven, trusted industry leader for power noise and reliability signoff for digital IP and SoCs down to 3nm and built on cloud-native elastic compute infrastructure Ansys RedHawk-SC is the industry’s trusted gold standard for voltage drop and electromigration multiphysics signoff solutions in digital designs. Its breakthrough SigmaDVD™ technology provides complete coverage for dynamic voltage drop analysis. Its powerful analytics identify weaknesses and allow what-if explorations to optimize power and performance. Redhawk-SC’s cloud-based architecture gives it the speed and capacity to handle full-chip analysis. Signoff accuracy is certified by all major foundries for all finFET nodes down to 2 nm.
Ansys Totem is the proven, trusted industry leader for power noise and reliability signoff for analog and mixed-signal designs built on cloud-native elastic compute infrastructure. Ansys Totem is the industry’s trusted gold standard voltage drop and electromigration multiphysics sign-off solution for transistor-level and mixed-signal designs. It is certified by all major foundries for finFET nodes down to 3nm with a track record of thousands of tapeouts. Totem-SC is cloud-native version of Totem based on SeaScape that gives it ultra-high speed and capacity to handle even the largest full-chip analyses.
The Maxwell CSIRO interface is not part of the standard Maxwell functionality. Users are required to purchase a licence that enables them to interface the modules with Maxwell. All users who purchase the CSIRO interface are given access via their existing website login for convenience. Furthermore, EMIT actively maintains the suite of CSIRO applications, correcting errors and adding additional functionality in response to user feedback and requests. Maxwell allows the user to define, display and edit model parameters through drag and drop mouse operation. Layered earth, thin-sheet, prism and mesh models can be built in Maxwell’s 3-D visualisation environment. Requires Maxwell version 5 or later Ground system configurations tested include drill-hole, fixed, coincident and in-loop systems and MT Airborne modules...
PICS3D, Photonic Integrated Circuit Simulator in 3D, is a state of the art 3D-simulator for surface and edge emission laser diodes, SOA, and other similar active waveguide devices. The 2D/3D semiconductor equations (drift-diffusion, Poisson, etc..) are coupled to the optical modes in both lateral and longitudinal directions. Optical properties such as quantum well/wire/dot optical gain and spontaneous emission rates are computed self-consistently. Available versions: 2024.x , 2023.x , 2021.x ,… Crosslight PICS3D (LASTIP) 2024.02 Tested Picture Starting from the 2016 version, the functionality of our 2D laser solver (LASTIP) has also been folded into PICS3D: this allows for easy simulation of laser devices without significant longitudinal effects and more flexibility for customers working on a variety of laser device designs....
APSYS, Advanced Physical Models of Semiconductor Devices, is based on 2D/3D finite element analysis of electrical, optical and thermal properties of compound semiconductor devices, with silicon as a special case. Emphasis has been placed on band structure engineering and quantum mechanical effects. Inclusion of various optical modules also makes this simulation package attractive for applications involving photosensitive or light emitting devices. Available versions: 2024.x , 2021.x ,… Crosslight APSYS 2024.02 Tested Picture Applications Diodes, transistors and various other types of silicon devices LEDs and OLEDs Solar cells Photodetectors (PD) High electron mobility transistors (HEMT) Heterojunction bipolar transistors (HBT) Resonant tunneling diodes (RTD) Quantum well infrared photodetectors (QWIP) Small MOS devices with strong quantum mechanical effects (Quantum-MOS) Power devices Features Restart...
CSUPREM (Crosslight-SUPREM) is a process simulation software package based on the SUPREM.IV.GS code developed at the Integrated Circuits Laboratory of Stanford University. SUPREM.IV.GS (2D) has long been recognized as the industry standard in process simulation for integrated circuit (IC) design for over a decade. Crosslight greatly enhances the capability of the original code from Stanford and extends it from 2D to 3D. Please refer to our full and mini CSUPREM product brochures for more details… Available versions: 2024.x , 2022.x ,… Crosslight CSuprem 2024 Tested Picture A brief introduction to Crosslight TCAD is also available in the following presentation and pamphlet. Features Reliable and flexible next-generation 2D/3D process simulator 2D, Quasi-3D, Hybrid-3D and Full 3D process simulation 2D and Full 3D device simulation when combined with APSYS GPU-accelerated solver Full...
Siemens.com IC-Custom 2024.3 is an enterprise-ready, custom IC design flow for innovative designs supporting both FinFET and planar analog, analog mixed-signal. With over 30 years of experience and thousands of design tape outs, this platform is well suited for “More than Moore” designs. Custom IC Design 2024 Release Highlights
