Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
Features
- Power integrity (EM/IR) analysis and modeling with RedHawk-SC for digital, and Totem-SC for analog designs
- Electrothermal analysis of 2.5D/3D multi-die systems
- Variability-aware path timing with Path FX
- Electrostatic discharge (ESD) and reliability analysis with PathFinder-SC
- RTL power analysis and reduction with PowerArtist
- On-silicon electromagnetic analysis and modeling with RaptorH, Pharos, Exalto, and VeloceRF
- Cloud-native elastic compute architecture for full-chip capacity
