IntelliSuite v8.8 includes major updates for all software modules and the addition of a new tool, Parametric Designer. IntelliSense made its initial announcement at the recent IEEE MEMS 2014 conference in San Francisco, CA. Now, all IntelliSense customers will have access to the new software version.
IntelliSuite include:
Process modeling
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- MEMaterial (Database and process optimization)
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- AnisE (Silicon Wet Anisotropic Etch Simulation)
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- RECIPE (RIE/ICP Simulator)
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- IntelliFAB (Process visualization)
- FabViewer
- IntelliEtch
Design Tools
- IntelliMask + Parametric Scripting
- 3D Builder (Meshing tool)
- Geometry Manipulator
- VisualEase
Analysis Tools
- ThermoElectroMechanical Analysis
- Microfluidics and BioMEMS Analysis
- Electromagnetics and RF MEMS Analysis
System Modeling
- SYNPLE Getting Started
- SYNPLE Element Library
- SYNPLE Advanced User Guide
- EDA Linker
Some of the new features in IntelliSuite v8.8 include:
Parametric Designer
Parametric Designer is the newest addition to the powerful family of IntelliSuite tools. This customized parametric analysis tool accepts a VBS file, then generates masks, 3D models and meshes automatically. Once the user applies boundary conditions and loads, Parametric Designer performs simulations then gives a detailed result report.
Hexpresso
Users can now handle meshing larger models automatically with the new 64-bit version of the Hexpresso mesh engine.
Blueprint
The Blueprint layout editor has some new drawing features, including an image import option that lets users add JPG, PNG and BMP images into their current layout.
Etch Process Simulation
The RECIPE simulator can now perform DRIE simulations with unparalleled accuracy with the new DEEP-RIE calibration tool. IntelliEtch also has a new calibration tool, Wagon Wheel Analyzer II which helps users extract etch rates accurately.
Device Simulation
ThermoElectroMechanical™ has been updated to perform simulations on magnetostrictive devices. The ElectroMagnetic Analysis™ tool has also received several updates for enhanced accuracy and usability.